【Electronic Industry】Wafer Iron Frame Peeling Machine

【Electronics Industry】

By utilizing dual robotic arms and a multi-axis control mechanism, we address the capacity challenges that were previously unattainable through manual efforts. More importantly, this solution mitigates the risk of occupational injuries caused by manual pulling and addresses potential issues related to mixing materials.

Wafer Iron Frame Peeling Machine: It separates the adhesive film from the wafer iron frame after chip extraction, folds the sticky film into a square shape, and stacks and seals it for convenient transportation and recycling.

Resolving occupational injuries from human factors and preventing packaging errors during personnel handling through batch management using barcode technology.

【Why Choose HeHe】

HeHe Automation has extensive experience in the development of backend equipment for the electronics industry and is familiar with the functionality of robotic arms. We can tailor equipment solutions suitable for cleanroom environments and the expectations of publicly listed companies, meeting your requirements for operational efficiency.

【Enhancing Efficiency, Creating Value】

The adhesive nature of the film on the iron frame makes traditional manual demolding time-consuming. This solution integrates simultaneous movements requiring multi-axis control, considering space occupancy and simplifying mechanism actions. Therefore, the plan involves the collaborative operation of 2 robotic arms, combining the demolding and folding mechanism for adhesive film to automate the entire process.

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